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MAX8556ETE Rev. A
RELIABILITY REPORT FOR MAX8556ETE PLASTIC ENCAPSULATED DEVICES
July 19, 2004
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Manager, Reliability Operations
Bryan J. Preeshl Quality Assurance Managing Director
Conclusion The MAX8556 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information V. ........Quality Assurance Information VI. .......Reliability Evaluation IV. .......Die Information .....Attachments
I. Device Description A. General The MAX8556 low-dropout linear regulator operates from input voltages as low as 1.425V and is able to deliver up to 4A of continuous output current with a typical dropout voltage of only 100mV. The output voltage is adjustable from 0.5V to VIN - 0.2V. Designed with an internal p-channel MOSFET pass transistor, the MAX8556 maintains a low 800A typical supply current, independent of the load current and dropout voltage. Using a p-channel MOSFET eliminates the need for an additional external supply or a noisy internal charge pump. Other features include a logic-controlled shutdown mode, built-in soft-start, short-circuit protection with foldback current limit, and thermal-overload protection. The MAX8556 features a POK output that transitions high when the regulator output is within 10% of its nominal output voltage. The MAX8556 is available in a 16-pin thin QFN 5mm x 5mm package with exposed paddle. B. Absolute Maximum Ratings Item IN, EN, POK, POR to GND FB, OUT to GND Output Short-Circuit Duration Operating Temperature Range Junction Temperature Storage Temperature Range Lead Temperature (soldering, 10s) Continuous Power Dissipation (TA = +70C) 16-Pin Thin QFN (5mm x 5mm) Derates above +70C (Note 1) 16-Pin Thin QFN (5mm x 5mm)
Rating -0.3V to +4V -0.3V to (VIN + 0.3V) Continuous -40C to +85C +150C -65C to +150C +300C 2666.7mW 33.3mW/C
Note 1: Maximum power dissipation is obtained using JEDEC JESD51-5 and JESD51-7 standards.
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: 4A Ultra-Low-Input-Voltage LDO Regulators S4 3137 California, USA Thailand, Hong Kong or Thailand April, 2004
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: 16-Pin QFN (5x5) Copper Solder Plate Conductive Epoxy Gold (2.0 mil dia.) Epoxy with silica filler # 05-9000-0801 Class UL94-V0
I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-A: Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 110 x 90 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Aluminum/Si (Si = 1%) None Metal1, Metal2 & Metal3 = 0.6 microns (as drawn) Metal1, Metal2 & Metal3 = 0.4 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Manager, Reliability Operations) Bryan Preeshl (Managing Director)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 192 x 4389 x 77 x 2 (Chi square value for MTTF upper limit)
Temperature Acceleration factor assuming an activation energy of 0.8eV = 14.28 x 10-9 = 14.28 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In Schematic (Spec. # 06-6240) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1N). B. Moisture Resistance Tests Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85C/85%RH testing is done per generic device/package family once a quarter. C. E.S.D. and Latch-Up Testing The PN29 die type has been found to have all pins able to withstand a transient pulse of 1500V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 250mA.
Table 1 Reliability Evaluation Test Results MAX8556ETE TEST ITEM TEST CONDITION FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES
PACKAGE
Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
77
0
DC Parameters & functionality
QFN
77
0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters & functionality 77 0
Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V , or V SS1 SS2 or V SS3 or V CC1 , or V CC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
c.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKET
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B
R = 1.5k C = 100pf
TERMINAL D Mil Std 883D Method 3015.7 Notice 8
ONCE PER SOCKET
ONCE PER BOARD
+3.3V
1 OHM
16
15
14
13
EN
1
N/C
G
IN IN IN IN IN
5
FB POK OUT OUT
12
20uF
2
11
3
10
25K
R2
20uF
4
IN
6
OUT OUT OUT
7 8
9
150 OHM
R4
25K
R3
Reserver space for R4 next to IC value TBD (around 150 Ohms. Both input and output caps are ceramic and close to chip. 3.3V in and 135 degree ambient temp. Junction temp is 150 degrees. TQFN = 47 degree/W. Power dissipation < 0.31W.
DEVICES: MAX 8556/7 (PN29Z) PACKAGE: 16-QFN (5x5) THIN MAX. EXPECTED CURRENT = 20mA
DRAWN BY: TEK TAN NOTES: Ave. expected current = 8mA
DOCUMENT I.D.
06-6240
REVISION B
MAXIM TITLE: BI Circuit: MAX8556/8557 (PN29Z)
PAGE
2

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